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Brand Name : Ceramic
Model Number : TFA615
Certification : ISO9001
Place of Origin : China
MOQ : 1PCS
Price : 0.99-99USD/PCS
Payment Terms : T/T, Paypal
Supply Ability : 50000pcs
Delivery Time : 2-10 working days
Packaging Details : Packing
Base Material : TFA615
Test Method : Flying Probe Test
Copper Weight : 0.5-3oz
Copper Thinknes : 1 oz
Model : XCET
Silkscreen : Green, Black, Blue, Yellow, Red etc.
Layers : 2
Country : China
Min Line Width : 5mil
Copper Thk : 1OZ
Surface Mount : Yes
Product Type : Printed Circuit Board
2-Layer TFA615 PCB: 0.6mm Thin, Immersion Gold Finish, and Aerospace-Grade High-Frequency Performance
 (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
  
  
 Overview of the 2-Layer TFA615 PCB
 The 2-layer TFA615 PCB is a high-performance printed circuit board designed for aerospace, microwave, and radar applications. Manufactured using the TFA615 PTFE ceramic composite dielectric material, this PCB exhibits outstanding electrical, thermal, and mechanical properties. With a dielectric constant of 6.15, low dissipation factor, and minimal anisotropy, this material is optimized for high-frequency and high-reliability systems in demanding environments.
  
 With a finished thickness of 0.6mm, immersion gold surface finish, and rigid structure, the TFA615 PCB meets IPC-Class-2 standards, making it an ideal solution for mission-critical applications in aerospace and satellite communications.
  
 
  
 PCB Construction Details
| Parameter | Specification | 
| Base Material | TFA615 | 
| Layer Count | 2 layers | 
| Board Dimensions | 206mm x 54mm ± 0.15mm | 
| Minimum Trace/Space | 4/6 mils | 
| Minimum Hole Size | 0.3mm | 
| Blind Vias | No | 
| Finished Thickness | 0.6mm | 
| Copper Weight | 1oz (1.4 mils) outer layers | 
| Via Plating Thickness | 20 μm | 
| Surface Finish | Immersion Gold | 
| Top Silkscreen | None | 
| Bottom Silkscreen | None | 
| Top Solder Mask | None | 
| Bottom Solder Mask | None | 
| Electrical Testing | 100% tested prior to shipment | 
 
  
 PCB Stackup
 The 2-layer TFA615 PCB stackup is engineered for superior RF and microwave performance, utilizing TFA615 material for its low dielectric loss and stable frequency characteristics. Below is the detailed layer structure:
| Layer | Material | Thickness | 
| Copper Layer 1 | Copper (1oz) | 35 μm | 
| Core Material | TFA615 | 0.508mm (20mil) | 
| Copper Layer 2 | Copper (1oz) | 35 μm | 
 
  
 PCB Statistics
 The 2-layer TFA615 PCB is designed for high-density routing and efficient component placement, ensuring reliable performance for complex systems. Key statistics include:
 
  
 Introduction to TFA615 Material
 TFA615 is a cutting-edge PTFE ceramic composite material, designed specifically for aerospace-grade applications. Unlike traditional fiberglass-reinforced laminates, TFA615 uses nano-ceramic particles and PTFE resin, eliminating the fiberglass effect on electromagnetic wave propagation. This results in exceptional frequency stability, low dielectric loss, and minimal anisotropy.
  
 The material’s balanced X/Y/Z thermal expansion coefficients ensure dimensional stability, even in extreme environments, while its high thermal conductivity aids in efficient heat dissipation.
  
  
 Features of TFA615
 
  
 Applications of TFA615 PCB
 
  
 Why Choose the 2-Layer TFA615 PCB?
 The 2-layer TFA615 PCB is the perfect choice for high-frequency and aerospace-grade applications. Its combination of advanced dielectric properties, minimal signal loss, and thermal reliability makes it a trusted solution in mission-critical systems.
  
 Contact us today for more information or to place an order!
  
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